Kyvadlový rázový tester je také velmi důležitý v aplikacích waferů. Oplatka je běžný tenký materiál, widely used in various fields, such as electronics, optics, kosmonautika, construction and so on. It is characterized by thin, světlo, hard, brittle and other properties, but at the same time, it also needs to have good mechanical strength and impact resistance to meet the specific needs of use. Proto, it is necessary to test the sheet using a pendulum impact tester to assess its mechanical properties and quality.

Wafer pro aplikace s kyvadlovým nárazovým nástrojem

Specific test
In wafer applications, the pendulum impact tester can perform the following tests:

Impact strength test: This test tests the impact strength of the sheet under certain temperature conditions to assess its mechanical strength and impact resistance.

Puncture strength test: This test tests the puncture strength of the wafer under certain conditions to assess its mechanical strength and impact resistance.

Tear strength test: This test tests the tear strength of the sheet under certain conditions to assess its mechanical strength and impact resistance.

Bending strength test: This test tests the bending strength of the sheet under certain conditions to assess its mechanical strength and impact resistance.

Prostřednictvím těchto testů, the mechanical properties and quality of the sheet can be fully assessed and its suitability for specific application areas can be determined. Navíc, the pendulum impact tester can also be used for quality control and inspection. Manufacturers can use the equipment to test the mechanical properties and quality of each batch of sheets to ensure that the quality meets the requirements of the standard.

Na závěr, the pendulum impact tester is of great significance in the application of wafer. It can help manufacturers evaluate the mechanical properties, impact resistance and quality of wafer to ensure that it can meet the specific requirements of use.