SPV-20 Macchina per la pulizia al plasma sottovuoto
- Descrizione
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Descrizione
SPV-20 Macchina per la pulizia al plasma sottovuoto
Contorno:
Vacuum Plasma Cleaner(Pulitore al plasma),il gas viene separato allo stato di plasma attraverso l'alimentazione di eccitazione, e il plasma agisce sulla superficie del prodotto per pulire gli inquinanti sulla superficie del prodotto, in modo da migliorare l'attività superficiale e migliorare l'adesione. La pulizia al plasma è una novità, protezione ambientale, trattamento superficiale efficiente e stabile.
SPV-20 Macchina per la pulizia al plasma sottovuoto
Pcaratteristica del prodotto:
1.Product placement fixture flexible, can adapt to irregular products
2.Horizontal electrode design can meet the requirements of soft product processing.
3.Low energy and gas consumption products.
4.Convenient way to put up and down the board
5.Vacuum system integration, small footprint
6.Reasonable plasma reaction space, so that the treatment is more uniform
7.Integrated control system design makes operation more convenient
SPV-20 Macchina per la pulizia al plasma sottovuoto
IOapplicazione industriale:
1.Mobile phone industry: TP, middle frame, back cover surface cleaning activation
2.PCB/FPC industry: hole drilling and surface cleaning, Coverlay surface coarsening and cleaning
3.Industria dei semiconduttori: semiconductor packaging, modulo fotocamera, LED packaging, BGA packaging, 4.Wire Bond pretreatment
5.Ceramics: confezione, pre-treatment of glue
6.Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon chip PN junction removal, ITO film etching
7.Plastic materials: Teflon surface activation, ABS surface activation, and other plastic material cleaning activation
8.Clean the surface before applying ITO
SPV-20 Macchina per la pulizia al plasma sottovuoto
Technical specifications
| Power system | Radio-frequency power supply | |
| Energia | 0~300W | |
| Frequenza | 13.56MHz | |
| Vacuum system
| Two-stage rotary vane pump (oil pump)
| 16m3/h |
| Vacuum line | All stainless steel piping, and high strength vacuum bellows | |
| Materiale | Aluminum alloy (customizable stainless steel chamber) | |
| Spessore | 25mm | |
| Leakproofness
| Military grade welding seal | |
| Internal dimension of cavity | 20l | |
| Available space spacing | 22.5mm | |
| Electrode plate layout | Horizontal layout, movable extraction | |
| Work tray | Standard set, material optional (alluminio, wire mesh) | |
| Gas system
| Intervallo di flusso | 0~300SCCM |
| Process gas gas circuit | Standard with two channels, can be customized | |
| Sistema di controllo | Systems control | PLC |
| Delivery method | 7 schermo tattile da pollici | |
| The Other Parameter
| Dimensione di confine | 900×1600×900mm（W×H×D） |
| Peso | 150KG | |
| Device appearance color | silver gray | |
specification requirements
| Factory specification requirements | |
| Ac power specifications | Alimentazione elettrica：AC380V，50/60Hz，5linee，50UN |
| Scarico di fabbrica | Flow：2.0 m³/min |
| Gas requirements for factory work | Flow：1~10 L/min Pressure：3~7kg/cm² Pipe diameter：6×4 mm Materiale: Tubo in PU Purezza: Sopra 99.99% |
| Factory compressed air requirements | Flow：1~10 L/min Pressure：3~7kg/cm² Pipe diameter：8×5 mm Materiale: Tubo in PU Dew point: below -40℃ Particella>0,3μm：10Pezzi/ft³ |
configuration list
| Elenco di configurazione | ||||
| NO | Nome | Descrizione | Unità | Qtà |
| 1 | Host | Dimensione di confine：900×1600×900mm（W×H×D） | Pc | 1 |
| 2 | Vacuum chamber | Aluminum alloy vacuum chamber | Pc | 1 |
| 3 | Excitation power supply | Radio-frequency power supply | Set | 1 |
| Frequenza：13.56MHz； Energia：0~300W Automatic vacuum capacitor matcher | ||||
| 4 | PLC | SIEMENS，S7-200 | Pc | 1 |
| 5 | touch screen | Vellon, 7 inch screen,MT6071iE | Pc | 1 |
| 6 | flowmeter | British Wawick brand | Pc | 2 |
| 7 | Vacuum pump | Flyover two-stage rotary vane pump (oil pump)：40m3/h | Pc | 1 |
| 8 | vacuum gauge | INFICON
| Pc | 1 |
| 9 | Manuale
| Operation manual of vacuum plasma cleaner SPV-20 | Pc | 1 |
