SPV-20    Vacuum plasma cleaning machine


Vacuum Plasma Cleaner(Plasma cleaner),the gas is separated into plasma state through the excitation power supply, and the plasma ACTS on the product surface to clean the pollutants on the product surface, so as to improve the surface activity and enhance the adhesion.Plasma cleaning is a new, environmental protection, efficient and stable surface treatment.

SPV-20    Vacuum plasma cleaning machine

Product feature:

1.Product placement fixture flexible, can adapt to irregular products

2.Horizontal electrode design can meet the requirements of soft product processing.

3.Low energy and gas consumption products.

4.Convenient way to put up and down the board

5.Vacuum system integration, small footprint

6.Reasonable plasma reaction space, so that the treatment is more uniform

7.Integrated control system design makes operation more convenient


 SPV-20    Vacuum plasma cleaning machine

Industry application:

1.Mobile phone industry: TP, middle frame, back cover surface cleaning activation

2.PCB/FPC industry: hole drilling and surface cleaning, Coverlay surface coarsening and cleaning

3.Semiconductor industry: semiconductor packaging, camera module, LED packaging, BGA packaging, 4.Wire Bond pretreatment

5.Ceramics: packaging, pre-treatment of glue

6.Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon chip PN junction removal, ITO film etching

7.Plastic materials: Teflon surface activation, ABS surface activation, and other plastic material cleaning activation

8.Clean the surface before applying ITO

SPV-20    Vacuum plasma cleaning machine

Technical specifications

Power systemRadio-frequency power supply
Vacuum system


Two-stage rotary vane pump (oil pump)


Vacuum lineAll stainless steel piping, and high strength vacuum bellows
MaterialAluminum alloy (customizable stainless steel chamber)


Military grade welding seal
Internal dimension of cavity20L
Available space spacing22.5mm
Electrode plate layoutHorizontal layout, movable extraction
Work trayStandard set, material optional (aluminum, wire mesh)
Gas system


Flow range0~300SCCM
Process gas gas circuitStandard with two channels, can be customized
Control systemSystems controlPLC
Delivery method7 inch touch screen
The Other Parameter


Boundary dimension900×1600×900mm(W×H×D)
Device appearance colorsilver gray

 specification requirements

Factory specification requirements
Ac power specificationsPower supply:AC380V,50/60Hz,5lines,50A
Factory exhaustFlow:2.0 m³/min
Gas requirements for factory workFlow:1~10 L/min

Pressure:3~7 kg/cm²

Pipe diameter:6×4 mm

Material: PU pipe

Purity: above 99.99%

Factory compressed air requirementsFlow:1~10 L/min

Pressure:3~7 kg/cm²

Pipe diameter:8×5 mm

Material: PU pipe

Dew point: below -40℃



configuration list

Configuration list
1HostBoundary dimension:900×1600×900mm(W×H×D)Pc1
2 Vacuum chamberAluminum alloy vacuum chamberPc1
3Excitation power supplyRadio-frequency power supplySet1


Automatic vacuum capacitor matcher

5touch screenVellon, 7 inch screen,MT6071iEPc1
6flowmeterBritish Wawick brandPc2
7Vacuum pumpFlyover two-stage rotary vane pump (oil pump):40m3/hPc1
8vacuum gaugeINFICON




Operation manual of vacuum plasma cleaner SPV-20Pc1

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