SPV-200    Vacuum plasma cleaning machine


Vacuum Plasma Cleaner(Plasma cleaner),the gas is separated into plasma state through the excitation power supply, and the plasma ACTS on the product surface to clean the pollutants on the product surface, so as to improve the surface activity and enhance the adhesion.Plasma cleaning is a new, environmental protection, efficient and stable surface treatment.

SPV-200    Vacuum plasma cleaning machine

Product feature:

1.Product placement fixture flexible, can adapt to irregular products

2.Horizontal electrode design can meet the requirements of soft product processing.

3.Low energy and gas consumption products.

4.Convenient way to put up and down the board

5.Vacuum system integration, small footprint

6.Reasonable plasma reaction space, so that the treatment is more uniform

7.Integrated control system design makes operation more convenient


 SPV-200    Vacuum plasma cleaning machine

Industry application:

1.Mobile phone industry: TP, middle frame, back cover surface cleaning activation

2.PCB/FPC industry: hole drilling and surface cleaning, Coverlay surface coarsening and cleaning

3.Semiconductor industry: semiconductor packaging, camera module, LED packaging, BGA packaging, 4.Wire Bond pretreatment

5.Ceramics: packaging, pre-treatment of glue

6.Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon chip PN junction removal, ITO film etching

7.Plastic materials: Teflon surface activation, ABS surface activation, and other plastic material cleaning activation

8.Clean the surface before applying ITO

SPV-200    Vacuum plasma cleaning machine

Specification of equipment:


Power systemradio-frequency power supplymedium-frequency power supply
vacuum system· multi cell pump


Roots pump + single stage rotary vane pump
vacuum lineAll stainless steel piping, and high strength vacuum bellows
· Material


Aluminum alloy (customizable stainless steel chamber)
leakproofnessMilitary grade welding seal
Cavity internal dimensions600×600×600mm(W×H×D)
Effective size of electrode plate575×510mm(W×D)
Available space spacing34mm
Electrode plate layoutHorizontal layout, movable extraction
Work trayStandard set, material optional (aluminum, wire mesh)
work space8 layer
Gas systemflow range0~300SCCM
Process gas gas circuitStandard two channels, can be customized (argon, oxygen, nitrogen, hydrogen, carbon tetrafluoride)
control systemsystems controlPLC
delivery method7 inch touch screen
·  Other Parameter


boundary dimension1050×1750×1050mm(宽×高×深)
Device Appearance Colorsilver gray

Factory specifications:

Factory specifications
Ac power specification


Power supply:AC380V,50/60Hz,5wire,50A
Factory exhaust


Flow:2.0 m³/min
Gas requirements for plant work


Flow:1~10 L/min

Pressure:3~7 kg/cm²

Pipe diameter:6×4 mm

Texture:PU pipe

Purity:More than 99.99%

Factory compressed air requirements


Flow:1~10 L/min

Pressure:3~7 kg/cm²

Pipe diameter:8×5 mm

Texture:PU pipe

Dew point:-40℃ under


2.3 General  Requirements

General requirements
Risk identificationHigh pressure hazard identification


Service environmenttemperature:15~30℃


Other matters needing attentionNo combustible gases, corrosive gases, explosions or reactive dust

Gas cylinders need to be fixed

                             Configuration list
Serial NumberNamedescriptionunitquantity
1Main engineboundary dimension:1050×1750×1050mm

(width × height × depth)

2Love sincerelyAluminum alloy vacuum chamber

inside dimension 450×450×500mm

(width × height × depth)

3Excitation power supplyradio-frequency power supplyedium-frequency power supplySet1

Power: 0~1000W

Equipped with automatic vacuum capacitor matching machine




5Touch screenWei lun tong,7 inch screen,MT6071iEPc1
6Flowmeter· British wawick brand,Argon,Oxygen


7Vacuum pumpRoots pump (BSJ70) -251 m3/h + single stage rotary vane pump (Laipo SV100B-100m3/h)Pc1
8Vacuum gauge· INFICON


9SpecificationVacuum plasma cleaning machine spv-200 operation manualPc1

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