Випробувальна камера для високої та низької температури, а також камера для холодного та теплового шоку зазвичай використовуються для випробування навколишнього середовища, but their test function and use mode are slightly different.

High and low temperature test chamber is mainly used to simulate the performance and stability of products in high temperature and low temperature environment. It usually has constant temperature and humidity, high and low temperature alternate, temperature gradient and other test functions, can be used in electronics, electrical appliances, аерокосмічний, automotive and other industries product testing. The high and low temperature test chamber usually has a high power refrigeration system and a large test space, which can carry out a long time of constant temperature and humidity test. The thermal shock box is mainly used to simulate the performance and stability of the product under extreme temperature changes. It usually has high speed temperature change, high and low temperature cycle, temperature impact and other test functions, can be used in electronics, electrical appliances, аерокосмічний, automotive and other industries product testing. The thermal shock box usually has the ability to rise and cool down quickly and can be used to test temperature changes in a short period of time.

Як розрізнити високотемпературний і низькотемпературний випробувальний бокс і гарячий і холодний ударний бокс

Конкретно, high and low temperature test box and cold and heat shock box are temperature environment test equipment, but their test purposes and test methods are different, the main differences are as follows:

Test purpose: the high and low temperature test chamber is mainly used to test the temperature resistance of the article, and the test process does not carry out rapid temperature change; The thermal shock box is mainly used to test the thermal shock and cold shock performance of items, and the rapid temperature change is required during the test.

Temperature change rate: high and low temperature test chamber in the test process, generally need to be relatively slow to rise and fall the temperature, the temperature change rate is usually 1℃/min or lower; The hot and cold shock box requires rapid temperature rise and fall, and the temperature change rate can reach 10 ° C /min or higher.

Температурний діапазон: high and low temperature test chamber can generally test the temperature range is relatively wide, generally -70℃ ~ 150℃ or higher; The test temperature range of the hot and cold shock box is relatively narrow, generally -40℃ ~ 150℃.

Як розрізнити високотемпературний і низькотемпературний випробувальний бокс і гарячий і холодний ударний бокс

Internal structure design: due to different test purposes and test methods, the internal structure design of high and low temperature test box and cold and heat shock box is also different. High and low temperature test chamber internal design is generally relatively simple, usually only need a temperature control system and a heating system; Thermal shock chambers, on the other hand, require a liquid nitrogen or liquid gas refrigeration system for rapid temperature changes.

Application scenario: high and low temperature test chamber is mainly used for temperature resistance test and environmental adaptability test, often used in electronics, electrical appliances, optoelectronics, automobile and other industries; The thermal shock box is mainly used to test the performance of materials, products and components in sharp temperature changes, often used in electronics, electrical appliances, автомобільний, aerospace and other industries.

Коротко, although both high and low temperature test chambers and cold and heat shock chambers are used for temperature environment testing equipment, due to the different test purposes and test methods, their use scenarios, temperature change rate, температурний діапазон, internal structure design and other aspects are quite different.