Machine de nettoyage plasma sous vide SPV-200
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Description
Machine de nettoyage plasma sous vide SPV-200
Outline:
Vacuum Plasma Cleaner(Nettoyant plasma),the gas is separated into plasma state through the excitation power supply, and the plasma ACTS on the product surface to clean the pollutants on the product surface, so as to improve the surface activity and enhance the adhesion.Plasma cleaning is a new, protection environnementale, efficient and stable surface treatment.
Machine de nettoyage plasma sous vide SPV-200
P.roduct feature:
1.Product placement fixture flexible, can adapt to irregular products
2.Horizontal electrode design can meet the requirements of soft product processing.
3.Low energy and gas consumption products.
4.Convenient way to put up and down the board
5.Vacuum system integration, petite empreinte
6.Reasonable plasma reaction space, so that the treatment is more uniform
7.Integrated control system design makes operation more convenient
Machine de nettoyage plasma sous vide SPV-200
jendustry application:
1.Mobile phone industry: TP, middle frame, back cover surface cleaning activation
2.PCB/FPC industry: hole drilling and surface cleaning, Coverlay surface coarsening and cleaning
3.Industrie des semi-conducteurs: semiconductor packaging, module caméra, LED packaging, BGA packaging, 4.Wire Bond pretreatment
5.Ceramics: emballage, pre-treatment of glue
6.Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon chip PN junction removal, ITO film etching
7.Plastic materials: Teflon surface activation, ABS surface activation, and other plastic material cleaning activation
8.Clean the surface before applying ITO
Machine de nettoyage plasma sous vide SPV-200
Specification of equipment:
| Power system | radio-frequency power supply | medium-frequency power supply | |
| pouvoir | 0~1000W | 0~2000W | |
| fréquence | 13.56MHz | 40KHz | |
| vacuum system | · multi cell pump
| Roots pump + single stage rotary vane pump | |
| vacuum line | All stainless steel piping, and high strength vacuum bellows | ||
| · Material
| Aluminum alloy (customizable stainless steel chamber) | ||
| épaisseur | 25mm | ||
| leakproofness | Military grade welding seal | ||
| Cavity internal dimensions | 600×600×600mm（W×H×D） | ||
| Effective size of electrode plate | 575×510mm（W×D） | ||
| Available space spacing | 34mm | ||
| Electrode plate layout | Horizontal layout, movable extraction | ||
| Work tray | Standard set, material optional (aluminium, wire mesh) | ||
| work space | 8 couche | ||
| Gas system | flow range | 0~300SCCM | |
| Process gas gas circuit | Standard two channels, Peut être personnalisé (argon, oxygène, azote, hydrogène, carbon tetrafluoride) | ||
| Système de contrôle | systems control | API | |
| delivery method | 7 écran tactile en pouces | ||
| · Other Parameter
| dimension de limite | 1050×1750×1050mm（宽×高×深） | |
| poids | 350KG | ||
| Device Appearance Color | silver gray | ||
Spécifications d'usine:
| Spécifications d'usine | |
| Spécification de l'alimentation CA
| Source de courant：AC380V，50/60Hz，5fil，50UN |
| Échappement d'usine
| Couler：2.0 m³/min |
| Gas requirements for plant work
| Couler：1~10 L/min Pression：3~7kg/cm² Diamètre du tuyau：6×4 mm Texture：Tuyau en PU Purity：Plus que 99.99% |
| Factory compressed air requirements
| Couler：1~10 L/min Pression：3~7kg/cm² Diamètre du tuyau：8×5mm Texture：Tuyau en PU point de rosée：-40℃ under Particule> 0,3 μm：10Pièces/pi³ |
2.3 gen général R.exigences
| Exigences générales | |
| Identification des risques | Identification des risques liés à la haute pression
|
| Environnement de services | température：15~30℃ humidité：30~70% |
| Autres questions nécessitant une attention particulière | Gaz incombustibles, gaz corrosifs, explosions ou poussières réactives Gas cylinders need to be fixed |
| Liste de configuration | |||||
| Serial Number | Nom | description | unité | quantité | |
| 1 | Moteur principal | dimension de limite：1050×1750×1050mm (width × height × depth) | Pc | 1 | |
| 2 | Love sincerely | Aluminum alloy vacuum chamber inside dimension 450×450×500mm (width × height × depth) | Pc | 1 | |
| 3 | Excitation power supply | radio-frequency power supply | edium-frequency power supply | Ensemble | 1 |
| fréquence：13.56MHz； Pouvoir： 0~1000W Equipped with automatic vacuum capacitor matching machine | fréquence：40KHz； 0~2000W;
| ||||
| 4 | API | Siemens，S7-200 | Pc | 1 | |
| 5 | Touch screen | Wei lun tong，7 inch screen，MT6071iE | Pc | 1 | |
| 6 | Débitmètre | · British wawick brand,Argon,Oxygène
| Pc | 2 | |
| 7 | Pompe à vide | Roots pump (BSJ70) -251 m3/h + single stage rotary vane pump (Laipo SV100B-100m3/h) | Pc | 1 | |
| 8 | Vacuum gauge | · INFICON
| Pc | 1 | |
| 9 | spécification | Vacuum plasma cleaning machine spv-200 operation manual | Pc | 1 | |
