説明

Product parameter

Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine
Functional characteristics
製品の表面改質
Fanrui プラズマ装置の改造により、材料の前処理の影響因子を効果的に低減できます。 95%

製品表面の活性化
Fangruiプラズマ装置で前処理された材料の表面活性化率は、 98%

製品表面の洗浄
Fanrui プラズマ装置の改造により、材料の前処理の影響因子を効果的に低減できます。 95%

製品表面の接着
素材表面の密着性を向上させました。 92% Fanruiプラズマ装置を使用して

Application of multiple industries
に適し 95% 業界, strong compatibility
自動車製造業
携帯電話製造業
繊維捺染業
半導体パッケージング産業
Heavy industry
新エネルギー産業
FBC/PCB分野
医療産業

Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine
初め, the advantages of vacuum equiseparation cleaning machine
Compared with traditional processes, plasma surface treatment technology has the following advantages:
[Strong function] : Modification only occurs on the surface of the material (about a few to dozens of nanometers), without changing the inherent properties of the matrix
To give one or more new functions;
[Wide application] : regardless of the substrate type of the treatment object, 金属などの, プラスチック, ガラス, ポリマー材料, 等, can be processed;
[Easy to operate] : simple process, 操作が簡単, strong production control and high stability;
[高効率] : short treatment time, high reaction rate, good treatment uniformity;
[Energy saving, 環境を守ること] : The whole process of dry treatment, no consumption of water resources, no need to add chemical agents, no pollution.
二, 製品導入
RD-10 Vacuum plasma cleaning machine is a vacuum reaction chamber can rotate 360° cleaning machine, widely used in small batch production of enterprises or universities for scientific research. The whole machine is compact, 安定したパフォーマンス, uniform and stable treatment effect, 高いコストパフォーマンス, vacuum reaction chamber can rotate 360°, 360° without dead Angle processing granular products and small irregular products.
1. Equipment composition
Plasma cleaning machine is composed of reaction chamber (also known as vacuum chamber), vacuum system, discharge system, electric control system, intake flow control system.
The reaction chamber consists of a vacuum chamber and an electrode, which is a plasma reaction space. The items to be treated are placed in the reaction chamber. The vacuum system consists of a vacuum gauge, a vacuum pump and a vacuum pipe, which is responsible for purifying the air in the reaction chamber and maintaining an appropriate vacuum degree during operation. The discharge system provides signal and energy for the reaction chamber to stimulate the ionization of the reaction gas in the chamber to form the plasma needed. The function of the electronic control system is to control the operation process of the equipment according to the optimal process parameters and steps, and maintain the stability of the process parameters; The intake flow control system is mainly composed of mass flowmeters and electromagnetic valves. Its function is to accurately control the intake flow of the reaction gas and maintain the vacuum required during the working period.
The device uses a touch screen +PLC programmable controller, processing parameters can be arbitrarily set on the touch screen, with manual/automatic switching function. The automatic operation adopts “one key type”, and the working process is completely controlled by the computer automatically. Manual operation is performed by the user on the manual mode interface.

Small vacuum plasma cleaner,Etcher for electronic products,Vacuum plasma surface treatment machine